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Lead-Free Electronic Solders A Special Issue Of The Journal Of Materials Science Materials In Electronics at Meripustak

Lead-Free Electronic Solders A Special Issue Of The Journal Of Materials Science Materials In Electronics

Books from same Author: SUBRAMANIAN K.N.

Books from same Publisher: SPRINGER

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    • General Information  
    Author(s)SUBRAMANIAN K.N.
    PublisherSPRINGER
    ISBN9780387484310
    Pages378
    BindingHardbound
    LanguageEnglish
    Publish YearApril 2007

    Description

    SPRINGER Lead-Free Electronic Solders A Special Issue Of The Journal Of Materials Science Materials In Electronics by SUBRAMANIAN K.N.

    Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. This comprehensive book examines all the important issues associated with lead-free electronic solder. It collects the work of researchers recognized for their significant scientific contributions in the area. Thermodynamics and phase diagrams of lead-free solder materials.- Phase diagrams of Pb-free solders and their related materials systems.- The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints.- Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications.- Rare-earth additions to lead-free electronic solders.- Compression stress-strain and creep properties of the 52In-48Sn and 97In-3Ag low-temperature Pb-free solders.- Sn-Zn low temperature solder.- Composite lead-free electronic solders.- Processing and material issues related to lead-free soldering.- Interfacial reaction issues for lead-free electronic solders.- Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys.- Deformation behavior of tin and some tin alloys.- Mechanical fatigue of Sn-rich Pb-free solder alloys.- Life expectancies of Pb-free SAC solder interconnects in electronic hardware.- Assessment of factors influencing thermomechanical fatigue behavior of Sn-based solder joints under severe service environments.- Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages.- Electromigration issues in lead-free solder joints.- Stress analysis of spontaneous Sn whisker growth.- Sn-whiskers: truths and myths.- Tin pest issues in lead-free electronic solders.- Issues related to the implementation of Pb-free electronic solders in consumer electronics.- Impact of the ROHS directive on high-performance electronic systems.- Impact of the ROHS Directive on high-performance electronic systems.